Hua Li Microelectronics Shanghai Campus - Fab 6
Overview
HLMC's second 300mm plant, built in the Kangqiao Industrial Park as part of Pudong's 'dual-base' layout with Fab 5 in Zhangjiang, brought 28/22nm mass production online in December 2018 at a reported investment of about RMB38.7 billion, HLMC's most advanced logic node. By 2023 the 28nm low-power process reportedly reached yields above 95%, and the fab's 40nm eFlash process received automotive-grade qualification. Hua Hong Semiconductor (HHGrace) completed the acquisition of a 97.5% controlling stake in HLMC in September 2026, bringing Fab 6 and sibling Fab 5 into the wider Hua Hong Semiconductor family. Key facility details include: The facility is situated at Kangqiao Industrial Park, Pudong, Shanghai, China. It focuses on Logic / Foundry and 22, 28 process nodes on 300mm wafers. This site represents an estimated investment of $5.4B and a production capacity of 40,000 wafers per month. Production at this facility commenced in 2018.
Hua Li Microelectronics Shanghai Campus
Part of the Huahong Group, alongside Hua Hong Semiconductor.
Facility Phases
Technology
About Hua Li Microelectronics
Hua Li Microelectronics (HLMC) is a 300mm pure-play wafer foundry based in Shanghai, majority-owned by the Shanghai municipal government with minority stakes from Huahong Group and Grace Semiconductor. It specializes in 55nm-28nm specialty process technologies including RF, embedded flash, and CMOS image sensors.