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Nisshinbo Micro Devices

Nisshinbo Micro Devices Β· 30-1 Saho, Kato City, Hyogo 673-1447, Japan
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N/A
Investment
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N/A
Wafers / Month
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1989
Production Start
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150mm, 200mm
Wafer Size

Overview

Nisshinbo Micro Devices' wafer fab in Kato City (the former town of Yashiro), Hyogo, Japan. The plant was opened by Ricoh in April 1989 as its Yashiro Plant for electronic-device manufacturing and passed to Ricoh Electronic Devices, which merged with New Japan Radio on 1 January 2022 to form Nisshinbo Micro Devices (a Nisshinbo Holdings subsidiary). Yashiro runs 6-inch (0.5 micron and larger) and 8-inch (0.18 micron and larger) silicon lines and is the group's main site for power ICs, power devices and image sensors. Monthly wafer capacity and plant cost are not publicly disclosed. Key facility details include: The facility is situated at 30-1 Saho, Kato City, Hyogo 673-1447, Japan. It focuses on Analog / Power, Sensors and 180, 500 process nodes on 150mm, 200mm wafers. Production at this facility commenced in 1989.

Facility Complex

Nisshinbo Micro Devices

N/A Total Investment
N/A Total WPM Capacity

Technology

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