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Construction

Tower Partners Semiconductor Co. (TPSCo)

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N/A
Investment
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N/A
Wafers / Month
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2027
Production Start
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300mm
Wafer Size

Overview

TPSCo's Arai facility (Fab 6) ceased production in July 2022, when it stopped exclusively serving Nuvoton Technology Corporation Japan (NTCJ). In July 2026, Tower Semiconductor announced a dual-track, up to $3 billion (net of grants) expansion of its Japan silicon photonics and SiGe capacity, backed by roughly $1 billion in METI grants; Track One converts Arai into a 300mm silicon photonics and advanced optical packaging plant, targeting full production readiness in Q4 2027. Key facility details include: The facility is situated at Arai, Niigata, Japan. It focuses on Photonics / Optical and 350, 150 process nodes on 300mm wafers. Production at this facility is expected to begin in 2027.

Facility Complex

Tower Partners Semiconductor Co. (TPSCo)

TBA Projected Investment
20,000 Projected WPM Capacity

* This is a sum of all 3 facility phases (current & planned).

Technology

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