Overview
Coherent (formerly II-VI) launched 200mm silicon carbide (SiC) epitaxial wafer production at its nearly 300,000 sq ft Easton, PA campus in September 2024, making it one of the largest 200mm SiC epi manufacturing lines in the world. In January 2025, the U.S. Department of Commerce signed a preliminary agreement for up to $79 million in CHIPS Act direct funding to expand Easton's capacity, targeting over 750,000 substrates/year and more than double the epitaxial wafer output. Key facility details include: The facility is situated at Easton, PA, USA. It focuses on Automotive / Specialty, Compound Semiconductor, SiC on 200mm wafers. Production at this facility commenced in 2024.
Coherent Easton Campus
Coherent's compound semiconductor facilities in Easton, Pennsylvania.
Facility Phases
About Coherent
Coherent Corp. (formed from the 2022 II-VI/Coherent merger) is a US laser, photonics, and compound-semiconductor materials company headquartered in Pennsylvania. Its silicon carbide (SiC) and indium phosphide (InP) fabs in Sweden (Jarfalla), Switzerland (Zurich), and the US (Easton, PA) supply substrates and epitaxial wafers for power electronics and optical networking; DENSO and Mitsubishi Electric each hold a 12.5% stake in its SiC business.