Overview
Amkor's Peoria campus in Arizona is an advanced semiconductor packaging and test megafacility, with groundbreaking in October 2025 and an investment that has grown to about US$7 billion. Co-located near TSMC's Phoenix-area fabs under a 10-year partnership, it will provide over 750,000 square feet of cleanroom and run TSMC's advanced packaging technologies such as Integrated Fan-Out (InFO) and Chip-on-Wafer-on-Substrate (CoWoS), with production targeted for 2028 and serving customers including Apple and NVIDIA. Key facility details include: The facility is situated at Peoria, Arizona, USA. It focuses on Assembly & Packaging. This site represents an estimated investment of $7B. Production at this facility is expected to begin in 2028.
Technology
About Amkor Technology
Amkor Technology is a global leader in outsourced semiconductor packaging and test services (OSAT). Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and testing and is a strategic manufacturing partner for the world's leading semiconductor companies.