Amkor Songdo Campus - K5
Overview
Amkor's K5 advanced packaging and test facility in Songdo, Incheon. Opened 2016 (investment 1.7 trillion KRW), employs 4,000+. Handles SiP, flip-chip, and EMIB packaging; Intel outsourced EMIB packaging here in 2025. Expanding with a new 4-story test building (266.1B KRW) targeting 2027 completion. Key facility details include: The facility is situated at Songdo Advanced Industry Cluster, Yeonsu-gu, Incheon, South Korea. It focuses on Advanced Packaging, Assembly & Packaging. Production at this facility commenced in 2016.
Technology
About Amkor Technology
Amkor Technology is a global leader in outsourced semiconductor packaging and test services (OSAT). Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and testing and is a strategic manufacturing partner for the world's leading semiconductor companies.