Amkor Technology - Hsinchu
Overview
Amkor Technology Taiwan is Amkor's Taiwanese back-end operation. Amkor established packaging plants in Taiwan in 2001, with its main facility in the Hsinchu Industrial Park at Hukou Township, Hsinchu County. It later added an advanced packaging and test plant (T6) in the Longtan section of the Hsinchu Science Park in Taoyuan, which began operations in 2018 and focuses on wafer probe, die processing and wafer-level packaging. As a back-end assembly and test operation it has no wafer-fab process node; monthly wafer capacity is not the relevant metric and plant cost is not disclosed. Key facility details include: The facility is situated at Hsinchu Industrial Park, Hukou Township, Hsinchu County, Taiwan (with an advanced-packaging plant in Longtan, Taoyuan). It focuses on Advanced Packaging, Assembly & Packaging. Production at this facility commenced in 2001.
Amkor Technology
Amkor Technology, Inc. (NASDAQ: AMKR), the world's second-largest outsourced semiconductor assembly and test (OSAT) provider, headquartered in Tempe, Arizona, with manufacturing across Asia, Europe and the United States.
Facility Phases
Technology
About Amkor Technology
Amkor Technology is a global leader in outsourced semiconductor packaging and test services (OSAT). Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and testing and is a strategic manufacturing partner for the world's leading semiconductor companies.