Tongfu Microelectronics - Penang
Overview
Tongfu Microelectronics' Penang plant traces back to AMD's first Malaysian assembly plant, established in the Bayan Lepas Free Industrial Zone in 1972, among the first wave of overseas semiconductor back-end plants in Penang alongside Intel and HP. Tongfu completed the acquisition of an 85% equity stake in AMD's Suzhou and Penang operations on 29 April 2015 (a US$371 million combined investment), continuing the plant's back-end assembly and test operations for processors and other devices. As a back-end assembly and test operation it has no wafer-fab process node; per-facility monthly wafer capacity is not disclosed and plant cost is not a fab metric here. Key facility details include: The facility is situated at Bayan Lepas Free Industrial Zone, Penang, Malaysia. It focuses on Assembly & Packaging. Production at this facility commenced in 1972.
Tongfu Microelectronics
Tongfu Microelectronics Co., Ltd. (SZSE: 002156), one of mainland China's largest outsourced semiconductor assembly and test (OSAT) providers, headquartered in Nantong, Jiangsu, with production bases across China and in Malaysia.
Facility Phases
Technology
About Tongfu Microelectronics
Tongfu Microelectronics Co., Ltd. (้ๅฏๅพฎ็ตๅญ, stock code: 002156 on Shenzhen Exchange) is one of China's largest OSATs, founded in 1997 and headquartered in Nantong, Jiangsu. Offers IC packaging and test including flip-chip BGA, SiP, memory packaging (HBM, LPDDR), wafer-level packaging, and automotive IC assembly. Strategic packaging partner for AMD. Seven production bases in Nantong (HQ), Hefei, Xiamen, Suzhou, and Penang (Malaysia). Revenue: ~US$3.73B trailing 12-month (as of 2025); 18,000+ employees.