Tongfu Microelectronics - Suzhou

Overview

Tongfu Microelectronics' Suzhou plant is a former AMD semiconductor packaging-and-test facility in the Suzhou Industrial Park, focused on high-end processor (CPU/GPU) chip packaging and testing. Tongfu completed the acquisition of an 85% equity stake in AMD's Suzhou and Penang operations on 29 April 2015 (a US$371 million combined investment with AMD's Penang plant), and the two companies held a launch ceremony for the strategic partnership and the Suzhou packaging-and-test base on 3 May 2016. The plant's original AMD-era opening year is not pinned to a single citable source (distinct from AMD's earlier, separate 1999 Suzhou flash-memory test line that became Spansion and was later sold to Powertech Technology), so Production Start is left blank rather than guessed. As a back-end assembly and test operation it has no wafer-fab process node; per-facility monthly wafer capacity is not disclosed and plant cost is not a fab metric here. Key facility details include: The facility is situated at Suzhou Industrial Park, Suzhou, Jiangsu, China. It focuses on Assembly & Packaging, Advanced Packaging. Production at this facility commenced in 2004.