Overview
Tongfu Microelectronics established its Xiamen operation in August 2017 through a RMB 70 million (about US$10.5 million) joint-venture investment in electronic-component manufacturing and R&D, aimed at expanding back-end testing capacity for mobile-handset and communications chips. As a back-end assembly and test operation it has no wafer-fab process node; per-facility monthly wafer capacity is not disclosed and plant cost is not a fab metric here. Key facility details include: The facility is situated at Xiamen, Fujian, China. It focuses on Assembly & Packaging. Production at this facility commenced in 2017.
Tongfu Microelectronics
Tongfu Microelectronics Co., Ltd. (SZSE: 002156), one of mainland China's largest outsourced semiconductor assembly and test (OSAT) providers, headquartered in Nantong, Jiangsu, with production bases across China and in Malaysia.
Facility Phases
Technology
About Tongfu Microelectronics
Tongfu Microelectronics Co., Ltd. (้ๅฏๅพฎ็ตๅญ, stock code: 002156 on Shenzhen Exchange) is one of China's largest OSATs, founded in 1997 and headquartered in Nantong, Jiangsu. Offers IC packaging and test including flip-chip BGA, SiP, memory packaging (HBM, LPDDR), wafer-level packaging, and automotive IC assembly. Strategic packaging partner for AMD. Seven production bases in Nantong (HQ), Hefei, Xiamen, Suzhou, and Penang (Malaysia). Revenue: ~US$3.73B trailing 12-month (as of 2025); 18,000+ employees.