Overview
Intel Fab 11X, at the Rio Rancho campus in New Mexico, was originally a logic wafer fab (built around 2002 for roughly US$3.5 billion) that Intel converted into an advanced packaging site. It now runs Intel's Foveros 3D stacking and EMIB (Embedded Multi-die Interconnect Bridge) packaging technologies for the company's chiplet-based products. Key facility details include: The facility is situated at Rio Rancho, New Mexico, USA. It focuses on Advanced Packaging and Foveros, EMIB process nodes on 300mm wafers. This site represents an estimated investment of $3.5B. Production at this facility commenced in 2002.
Technology
About Intel
Intel is an industry leader, creating world-changing technology that enables global progress. As an Integrated Device Manufacturer (IDM), Intel is expanding its local manufacturing footprint through the Intel Foundry Services (IFS) initiatives.