Overview
Intel Fab 9, at the Rio Rancho campus in New Mexico, is part of the site Intel converted from legacy logic manufacturing into an advanced packaging and assembly operation, with about US$3.5 billion invested to bring it online in 2024. It supports 3D die stacking and heterogeneous integration for Intel's chiplet products. Key facility details include: The facility is situated at Rio Rancho, New Mexico, USA. It focuses on Assembly & Packaging on 300mm wafers. This site represents an estimated investment of $3.5B. Production at this facility commenced in 2024.
Technology
About Intel
Intel is an industry leader, creating world-changing technology that enables global progress. As an Integrated Device Manufacturer (IDM), Intel is expanding its local manufacturing footprint through the Intel Foundry Services (IFS) initiatives.