$3.5B
Investment
N/A
Wafers / Month
2024
Production Start
N/A
Wafer Size
Overview
Intel Fab 9 & 11x (Advanced Packaging) is an active semiconductor manufacturing facility operated by Intel in USA. Key facility details include: The facility is situated at Rio Rancho, New Mexico, USA. It focuses on Advanced Packaging. This site represents an estimated investment of $3.5B. Production at this facility commenced in 2024.
Technology
About Intel
Intel is an industry leader, creating world-changing technology that enables global progress. As an Integrated Device Manufacturer (IDM), Intel is expanding its local manufacturing footprint through the Intel Foundry Services (IFS) initiatives.
Data Quality: 52%