Overview
Intel Fab 9 & 11X at the Rio Rancho campus in New Mexico form Intel's advanced packaging hub, brought online in 2024 after a roughly US$3.5 billion investment. The site runs Intel's Foveros 3D die-stacking and EMIB interconnect technologies, key to the company's chiplet and heterogeneous-integration roadmap. Key facility details include: The facility is situated at Rio Rancho, New Mexico, USA. It focuses on Advanced Packaging. This site represents an estimated investment of $3.5B. Production at this facility commenced in 2024.
Technology
About Intel
Intel is an industry leader, creating world-changing technology that enables global progress. As an Integrated Device Manufacturer (IDM), Intel is expanding its local manufacturing footprint through the Intel Foundry Services (IFS) initiatives.