Taiwan Advanced Packaging Hub - Phase 1 (HBM)

Overview

Formerly PSMC Fab P5, the Tongluo Science Park facility opened in May 2024 after a ~$9.5 billion investment, designed for 50,000 12-inch wafers per month at 55/40/28nm. Micron agreed in January 2026 to acquire the P5 site for $1.8 billion in cash and expects it to contribute meaningful DRAM wafer output from the second half of calendar 2027, with PSMC providing long-term DRAM advanced-packaging (post wafer finishing) foundry services for Micron's HBM ramp. Key facility details include: The facility is situated at Tongluo Science Park, Miaoli, Taiwan. It focuses on Advanced Packaging, Memory on 300mm wafers. This site represents an estimated investment of $9.2B and a production capacity of 50,000 wafers per month. Production at this facility commenced in 2024.