Overview
Singapore's first high-bandwidth memory (HBM) advanced packaging facility, built adjacent to Micron's existing Woodlands campus. Ground broken January 2025 with an investment of approximately US$7B; operations begin in 2026, with meaningful expansion of Micron's total advanced packaging capacity from calendar 2027. Expected to create ~1,400 jobs initially, rising toward 3,000; the facility also supports long-term NAND manufacturing needs. Key facility details include: The facility is situated at Woodlands, Singapore (adjacent to existing Micron campus). It focuses on Advanced Packaging, Memory on 300mm wafers. This site represents an estimated investment of $7B. Production at this facility is expected to begin in 2026.
Micron Singapore
Micron's primary 3D NAND manufacturing hub in Singapore.
* This is a sum of all 6 facility phases (current & planned).
Facility Phases
Technology
About Micron Technology
Micron is a world leader in innovative memory and storage solutions. Through its global brands, Micron and Crucial, the company delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products.