Overview
A new dedicated HBM (High Bandwidth Memory) fabrication and advanced packaging facility planned for the Chungcheong region of South Korea. Samsung Electronics will invest 56 trillion won (~$36 billion) in this site as part of a 140 trillion won Samsung Group commitment to the Chungcheong region, announced under South Korea's 'Three Mega Projects' initiative in June 2026. Exact city within Chungcheong Province is not yet confirmed. Key facility details include: The facility is situated at Chungcheong Province, South Korea. It focuses on Advanced Packaging, DRAM on 300mm wafers. This site represents an estimated investment of $36.1B.
Technology
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