Overview
This module at the Cheonan site focuses on Wafer-Level Packaging (WLP) and Fan-Out Panel-Level Packaging (FO-PLP) for mobile and high-performance computing applications. The FO-PLP line originated with Samsung Electro-Mechanics, which invested KRW 263.2 billion (~$231 million) to establish its panel-level-packaging manufacturing lines in Cheonan and began PLP mass production in 2018, packaging the application processor of the Galaxy Watch; Samsung Electronics acquired the PLP business from Samsung Electro-Mechanics in 2019. Key facility details include: The facility is situated at Cheonan-si, Chungcheongnam-do, South Korea. It focuses on Advanced Packaging and FO-WLP, FO-PLP process nodes on 300mm wafers. This site represents an estimated investment of $0.23B. Production at this facility commenced in 2018.
Samsung Cheonan Campus
Samsung's primary hub for advanced memory packaging, including HBM and WLP.
Facility Phases
Technology
About Samsung
Samsung Electronics is a global leader in technology, opening new possibilities for people everywhere. Through relentless innovation and discovery, we are transforming the worlds of TVs, smartphones, wearable devices, and semiconductors.