Overview
A new DRAM/HBM memory fab complex planned for Gwangju in southwestern South Korea. On June 29, 2026, in the presence of President Lee Jae Myung, Samsung and SK Hynix announced a combined 800 trillion won (~$518B) program to build four to six new front-end fabs in the Honam region, with Samsung selecting Gwangju as its site (candidate locations include the grounds of a military air base slated for relocation). Samsung's share of the long-term program is roughly 400 trillion won. The plan is meant to diversify Korea's chip industry away from the capital region and add DRAM/HBM capacity for AI demand; per-fab investment, capacity and timeline have not yet been disclosed. Key facility details include: The facility is situated at Gwangju Metropolitan City, South Korea. It focuses on DRAM on 300mm wafers.
Technology
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