Overview
This module at the Onyang campus handles high-volume legacy assembly and packaging for a wide range of semiconductor products. The Onyang campus, established in 1991, was Samsung Electronics' only dedicated packaging base until the Gwangju packaging project surfaced in 2026. Key facility details include: The facility is situated at Asan-si, Chungcheongnam-do, South Korea. It focuses on Assembly & Packaging. Production at this facility commenced in 1991.
Samsung Onyang Campus
Samsung's largest global assembly and test hub.
Facility Phases
Technology
About Samsung
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