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Samsung Onyang Campus - Mainstream Packaging

Samsung Β· Asan-si, Chungcheongnam-do, South Korea
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Investment
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1991
Production Start
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Overview

This module at the Onyang campus handles high-volume legacy assembly and packaging for a wide range of semiconductor products. The Onyang campus, established in 1991, was Samsung Electronics' only dedicated packaging base until the Gwangju packaging project surfaced in 2026. Key facility details include: The facility is situated at Asan-si, Chungcheongnam-do, South Korea. It focuses on Assembly & Packaging. Production at this facility commenced in 1991.

Facility Complex

Samsung Onyang Campus

Samsung's largest global assembly and test hub.

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Samsung

About Samsung

Samsung Electronics is a global leader in technology, opening new possibilities for people everywhere. Through relentless innovation and discovery, we are transforming the worlds of TVs, smartphones, wearable devices, and semiconductors.

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