TSMC Advanced Backend Fab 2
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Overview
TSMC Advanced Backend Fab 2 is an advanced packaging facility located in Tainan. In 2024, TSMC expanded its advanced packaging capabilities at this site to meet rapidly changing market challenges and satisfy greater demand brought by the growth of AI. Key facility details include: The facility is situated at 1, Sanbaozhu Rd., Southern Taiwan Science Park, Tainan 741-013, Taiwan, R.O.C.. It focuses on Assembly & Packaging, Advanced Packaging.
Technology
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world's leading dedicated semiconductor foundry ever since. TSMC manufactures chips for virtually all major fabless semiconductor companies.
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