N/A
Investment
N/A
Wafers / Month
2029
Production Start
300mm
Wafer Size
Overview
TSMC Fab 21 Advanced Packaging Facility 1 is a planned backend packaging plant at the Arizona campus. It is designed to bring crucial packaging capabilities onshore, bridging the gap between wafer fabrication and finalized modules for high-performance computing customers. Key facility details include: The facility is situated at Phoenix, Arizona, USA. It focuses on Advanced Packaging on 300mm wafers. Production at this facility is expected to begin in 2029.
Technology
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world's leading dedicated semiconductor foundry ever since. TSMC manufactures chips for virtually all major fabless semiconductor companies.
Data Quality: 83%