TSMC Advanced Backend Fab 6
Overview
TSMC Advanced Backend Fab 6, in the Zhunan Science Park, Miaoli County, is TSMC's largest advanced packaging and testing facility. Built from 2020 and officially opened in June 2023, it flexibly allocates capacity for TSMC's 3DFabric technologies, including SoIC, InFO and CoWoS silicon stacking, plus advanced testing, supporting demand from HPC, AI and mobile applications. Key facility details include: The facility is situated at No.1, Kezhuan 1st Rd., Zhunan Township, Miaoli County 350-012, Taiwan, R.O.C.. It focuses on Advanced Packaging. Production at this facility commenced in 2023.
Technology
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world's leading dedicated semiconductor foundry ever since. TSMC manufactures chips for virtually all major fabless semiconductor companies.