TSMC Advanced Backend Fab 3
Overview
TSMC Advanced Backend Fab 3 (AP3) in Longtan Science Park, Taoyuan, is the company's advanced packaging site dedicated mainly to InFO (Integrated Fan-Out) wafer-level packaging and wafer-level multi-chip modules for high-end mobile processors, with Apple as the primary customer. The building received LEED Gold certification in August 2012. Key facility details include: The facility is situated at 101, Longyuan 6th Rd., Longtan Dist., Taoyuan City 325-42, Taiwan R.O.C.. It focuses on Assembly & Packaging, Advanced Packaging.
Technology
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world's leading dedicated semiconductor foundry ever since. TSMC manufactures chips for virtually all major fabless semiconductor companies.