TSMC Advanced Backend Fab 1
Overview
TSMC Advanced Backend Fab 1 is the company's original back-end site in the Hsinchu Science Park, providing bumping, wafer-level packaging, assembly and final test services. It anchored TSMC's move into in-house advanced packaging and remains part of the company's back-end network alongside the newer Advanced Backend fabs in Tainan, Taoyuan, Taichung, Zhunan and Chiayi. Key facility details include: The facility is situated at 6, Creation Rd. 2, Hsinchu Science Park, Hsinchu 300-093, Taiwan, R.O.C.. It focuses on Advanced Packaging.
Technology
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world's leading dedicated semiconductor foundry ever since. TSMC manufactures chips for virtually all major fabless semiconductor companies.