TSMC Chiayi Science Park (AP7) - Phase I, Fab 1 (P1)
Overview
The first advanced packaging fab at TSMC's Chiayi Science Park hub (Advanced Backend Fab 7), built to expand CoWoS capacity for AI and high-performance computing chips. Groundbreaking took place in May 2024 and construction was briefly paused by archeological findings at the site. Together with its Phase I sibling, the fab began mass production in June 2026. Key facility details include: The facility is situated at Chiayi Science Park, Taibao City, Chiayi County, Taiwan. It focuses on Assembly & Packaging, Advanced Packaging on 300mm wafers. Production at this facility commenced in 2026.
TSMC Chiayi Science Park (AP7)
TSMC's advanced packaging hub at the Chiayi Science Park in Taibao, southern Taiwan. Phase I holds two fabs that entered mass production in 2026; a roughly 90-hectare Phase II that broke ground in July 2026 is planned to add three more advanced packaging fabs.
* This is a sum of all 3 facility phases (current & planned).
Facility Phases
Technology
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world's leading dedicated semiconductor foundry ever since. TSMC manufactures chips for virtually all major fabless semiconductor companies.