N/A
Investment
N/A
Wafers / Month
TBA
Production Start
300mm
Wafer Size
Overview
TSMC Fab 21 Advanced Packaging Facility 2 is the second planned advanced backend packaging site for the gigafab complex, intended to scale up domestic capacities alongside the campus's front-end wafer fabrication plants. Key facility details include: The facility is situated at Phoenix, Arizona, USA. It focuses on Advanced Packaging on 300mm wafers.
Technology
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world's leading dedicated semiconductor foundry ever since. TSMC manufactures chips for virtually all major fabless semiconductor companies.
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