Overview
TSMC Fab 2, in the Hsinchu Science Park, is one of TSMC's earliest wafer fabs, a 6-inch (150mm) line that entered production in 1990. Kept in service for legacy and specialty products, it runs mature large-geometry logic processes from 0.8-micron down to 0.45-micron, with a capacity of roughly 88,000 wafers per month. Key facility details include: The facility is situated at 121,Park Ave.3,Hsinchu Science Park,Hsinchu300-77,Taiwan,R.O.C.. It focuses on Logic / Foundry and 800, 600, 500, 450 process nodes on 150mm wafers. This site represents an estimated investment of $0.735B and a production capacity of 88,000 wafers per month. Production at this facility commenced in 1990.
Technology
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world's leading dedicated semiconductor foundry ever since. TSMC manufactures chips for virtually all major fabless semiconductor companies.