TSMC Chiayi Science Park (AP7) - Phase II
Overview
The Phase II expansion of TSMC's Chiayi Science Park advanced packaging hub, covering roughly 90 hectares, broke ground on July 13, 2026 and is planned to house three additional advanced packaging fabs according to park authorities. Once both phases are fully operational, the park is expected to generate more than NT$300 billion (about US$9.35 billion) in annual output and create over 9,000 jobs. Key facility details include: The facility is situated at Chiayi Science Park Phase II, Taibao City, Chiayi County, Taiwan. It focuses on Assembly & Packaging, Advanced Packaging on 300mm wafers.
TSMC Chiayi Science Park (AP7)
TSMC's advanced packaging hub at the Chiayi Science Park in Taibao, southern Taiwan. Phase I holds two fabs that entered mass production in 2026; a roughly 90-hectare Phase II that broke ground in July 2026 is planned to add three more advanced packaging fabs.
* This is a sum of all 3 facility phases (current & planned).
Facility Phases
Technology
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world's leading dedicated semiconductor foundry ever since. TSMC manufactures chips for virtually all major fabless semiconductor companies.