TSMC Chiayi Science Park (AP7) - Phase I, Fab 2 (P2)
Overview
The second Phase I advanced packaging fab at TSMC's Chiayi Science Park hub, expanding CoWoS capacity for AI and high-performance computing chips. Taiwanese science park authorities reported the two Phase I fabs beginning mass production in June 2026, with the second plant ramping up shortly after the first. Key facility details include: The facility is situated at Chiayi Science Park, Taibao City, Chiayi County, Taiwan. It focuses on Assembly & Packaging, Advanced Packaging on 300mm wafers. Production at this facility commenced in 2026.
TSMC Chiayi Science Park (AP7)
TSMC's advanced packaging hub at the Chiayi Science Park in Taibao, southern Taiwan. Phase I holds two fabs that entered mass production in 2026; a roughly 90-hectare Phase II that broke ground in July 2026 is planned to add three more advanced packaging fabs.
* This is a sum of all 3 facility phases (current & planned).
Facility Phases
Technology
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world's leading dedicated semiconductor foundry ever since. TSMC manufactures chips for virtually all major fabless semiconductor companies.