TSMC Chiayi Science Park (AP7) - Phase III

Overview

A proposed third-phase expansion of TSMC's Chiayi Science Park advanced packaging hub, on roughly 198.65 hectares of farmland owned by state-run Taiwan Sugar Corporation adjacent to the existing park. Taiwan's National Science and Technology Council began soliciting public comment on the proposal on 24 September 2026 (consultation period running to 24 October 2026); the project still requires feasibility assessment, review by the Executive Yuan, and urban-planning/environmental-impact-assessment procedures before construction could begin. Reporting describes five additional advanced-packaging plants, which combined with the existing Phase I (2 fabs) and Phase II (3 fabs, under construction) would bring the site to 10 total facilities, described as the world's largest back-end cluster for high-density chip assembly. TSMC has made no public cost or capacity disclosure specific to this phase. Key facility details include: The facility is situated at Chiayi Science Park Phase III (proposed), Taibao City, Chiayi County, Taiwan. It focuses on Assembly & Packaging, Advanced Packaging on 300mm wafers.